DeLOCK 18471, Thermalpolster, 3,2 W/m·K, Grau, -60 - 180 °C, 20 mm, 120 mm

The Delock thermal pad is designed for effective thermal management, especially suited for M.2 modules. With a thermal conductivity of 3.2 W/mK, it ensures optimal heat dissipation, helping to maintain performance and reliability in various applications. The pad measures 120 x 20 x 3 mm and is formulated to minimize oil bleeding, making it a solid choice for efficient thermal interface solutions. Packaged in a zip poly bag, this thermal pad provides the necessary insulation and conductivity needed to keep components running smoothly, even under extreme temperatures ranging from -60 °C to 180 °C.